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Larger hip movements, which are penalized by gymnast judges, may occur during antiphase coordination, such that the gymnasts had learned to resist a more natural coordination mode The strength of patterns of coordination and the fluidity of movement, often indicative of skilled performance, has also been captured by spectral analysis Spectral analysis highlights temporal patterning in a continuous movement such as rowing or running, whereby the time series is transformed into the frequency domain, resulting in a power spectral density estimate (Stocia & Moses, 1997) From estimations of the spectral densities of the ball trajectories in three-ball cascade juggling, Huys and Beek (2002) showed that the degree of coordination among the juggled balls was higher in expert jugglers than in intermediate jugglers A drawback of spectral analysis is that information over time is lost, which sometimes can be of pivotal importance.

For instance, during rowing, certain frequency relations between the legs and breathing rates are often.

E10.9

Select the layer you want to unlink. Do one of the following:

Microorganism(s) Interventions in sequence 1st 2nd Water (35 C) Water ASCb (200 ppm) ASC (200 ppm) Water Water Water Water ASC (500 ppm) ASC (500 ppm) Water Water ASC (200 ppm) ASC (200 ppm) ASC (500 ppm) ASC (500 ppm) Water Water NA NA PAA (180 ppm) NA NA Steam-vacuuming (30 s) NA NA Water (32 C, 12 s) Water (72 C, 12 s) 3rd NAa Vacuum NA Vacuum NA Vacuum NA Vacuum NA Vacuum NA Vacuum NA Vacuum NA Vacuum NA Vacuum NA NA NA NA NA NA NA NA NA Water (32 C, 12 s) NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA E. coli O157:H7 4th Coliforms

4 6 Elapsed time (h)

SA = R1(x1), W1(x1), R2(x2), R4(x1), W2(x2), W3(x2), R4(x2) SB = R5(x3), R1(x3), R3(x4), W2(x4), R5(x4), R3(x3)

carriers, and other forms of packages that semiconductor chips are mounted upon Off-chip spark gaps have the advantage of not using area on a semiconductor chip Spark gaps and FEDs can be constructed on-chip or off-chip as a form of ESD protection [5 7] Spark gaps can be formed using metallization patterns formed on the package or substrate material using closely spaced metal lines Spark gaps formed on the ceramic substrate are limited by the allowed metal line-to-line spacing A disadvantage of the offchip implementation of a spark gap is the line-to-line spacing that is signi cantly larger than what is achievable in an on-chip implementation Spark gap reliability is critical; this manifests itself in the ability to discharge, as well as repeatability is an important issue in using spark gap as ESD protection Another limitation of spark gaps is the reaction time.

Gas discharges that occur in the spark gaps have a nanosecond reaction time Another limitation is the breakdown voltages that occur Hence, spark gaps have the following limitations [7]: reliability of electrical discharge initiation; repeatability of discharge current and voltage magnitude; time constant response of the arc discharge; magnitude of the breakdown voltages (eg, compared to the application device sensitivity) During discharge events, electrical damage can occur to the spark gap electrodes leading to reliability concerns Moreover, with damage to the electrode curvature, and material residuals, the repeatability may be inadequate to insure or qualify the off-chip spark gap Additionally, for RF applications, the time constant associated with the breakdown, gas ionization, and the reverse recovery time of the ionized gas may be long compared to circuit response of RF circuitry.

Spark gap initiation time is a function of the collision and ionization times; the time constant to initiate ionization of gas molecules associated with avalanche multiplication [1 4] Breakdown in gases is initiated by a feedback induced by the acceleration of carriers leading to secondary carriers At very high speed, the ability to provide semiconductor devices may be limited And lastly, another concern is the magnitude of the trigger voltage of the spark gap Paschen studied the breakdown physics of gases in planar gap regions [1] The result of Paschen showed that breakdown process is a function of the product of the gas pressure and the distance between the electrodes Paschen showed that pd % d l.